Standards
This document describes a test method for determining the resistance to separation of the upper from the outsole, for separating adjacent layers of the outsole or for causing tear failure of the upper or the sole. It also defines conditions of ageing that can be used for production control.
This document is applicable to all types of footwear (cementing, vulcanisation, injection moulding, etc.) where the evaluation of sole adhesion on the upper is needed and where the upper is continuously assembled (closed shoe).
NOTE 1 In all cases the objective is to test the bond strength nearest to the edge of the assembly.
NOTE 2 The test need not be carried out when the bond has been made by grindery (using, for example, nails or screws) or stitching.
This document specifies a method for the determination of the abrasion resistance for outsoles,
This document specifies three methods for determining the shape retention properties and compression strength of a doomed test specimen.
This part of IEC 61850 specifies the information model of devices and function related to substation applications . IN particular , it specified the compatible logical mode names and data names for communication between intelligent . Electronic devices (IED) . This includes the relationship between logical nodes ands data.