Standards

This standard specifies basic methods for testing the physical properties of paints and surface coatings.

The standard prescribes a maximum limit on the lead content in paints and varnishes supplied in fluid form. It applies to paints and varnishes that are used in households, on domestic furniture and appliances, in buildings and places open to the public shops, offices, factories, or for commercial purposes. This standard does not apply to paints supplied in the form of dried powder, or intended for industrial use.

This standard applies to emulsion paint for interior and exterior use on masonry surfaces including concrete, brick, stucco, concrete block and on primed wood. It is not suitable for metal derived products.

This standard applies to low sheen and semi-gloss emulsion paint for use on types of interior and exterior wall surfaces and ceilings. It is suitable for application over surfaces including wallboard, gypsum-board, cement, dry plaster, brick, concrete block wall or block walls rendered with cement-mortar, gypsum plaster or any other such material applied for providing a protective coating.

This standard prescribes requirements for ready mixed alkyd paint for interior and exterior applications. The material is used for protection and decoration of wood and metal and other surfaces suitably primed.  

This standard specifies the requirements and the methods of sampling and test for lacquer. 

This standard specifies methods of sampling and test for thinners and solvents for paints.  It covers the methods for determination of colour, relative density, distillation range, residue on evaporation, tests for corrosive sulphur, freedom from chlorinated hydrocarbon solvents and benzene, kauri butanol value, aniline point and mixed aniline point, acid wash test, test for hydrogen sulphide and mercaptans, freedom from lead, flash point and keeping quality.

This part of IEC 61850 specifies the information model of devices and function related to substation applications . IN particular , it specified the compatible logical mode names and data names for communication between intelligent . Electronic devices (IED) . This includes the relationship between logical nodes ands data.